Cadence Awarded TSMC OIP Ecosystem Forum Customers’ Choice Award for 3D-IC Design
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has received a TSMC Open Innovation Platform® (OIP) Ecosystem Forum Customers’ Choice Award for a paper titled “Integrated Platform for 3D-IC Design”, which was presented at the TSMC 2021 North America OIP Ecosystem Forum. Cadence’s Thunder Lay, Director of Software Engineering, presented the article, highlighting the benefits of the recently introduced Cadence® Integrity™ 3D-IC Platform, the industry’s first comprehensive, unified platform for 3D-IC design planning, optimization, implementation and approval.
With 3D-IC packaging becoming increasingly popular due to today’s design requirements, the Cadence document received the highest average score among forum attendees. Designers learned how the Integrity 3D-IC platform enables system-driven power, performance, and area (PPA) for individual chips through integrated thermal, power, and static timing analysis capabilities. The platform is ideal for customers building emerging large-scale, consumer computing, 5G communications, mobile and automotive applications and supports TSMC’s 3DFabric™ technologies. For more information on the Integrity 3D-IC platform, visit www.cadence.com/go/integrity3dic.
“The Integrity 3D-IC platform helps customers manage high-level 3D-IC design aggregation and management, system-level review and approval challenges, and costly die overdesign individuals,” said Don Chan, Vice President, Research and Development. “What really sets the Integrity 3D-IC platform apart from other solutions in the industry is that it is tightly integrated with Cadence’s analysis tools, giving customers an added benefit of system-driven PPA. Recognition of the Customers’ Choice award reflects our strong 3D-IC collaboration with TSMC, and we look forward to working with joint customers to enable them to achieve their design goals with our new platform and TSMC’s 3DFabric technologies. .
“Cadence’s article explained how the integrated Integrity 3D-IC platform, combined with TSMC’s advanced 3DFabric technologies, enables a system-level approach to product design to improve PPA and time-to-market. market,” said Suk Lee, vice president of Design Infrastructure Management Division at TSMC. “I am delighted to congratulate Cadence on winning this Customers’ Choice award and look forward to our continued collaboration with Cadence to enable cutting-edge 3D-IC designs and help customers accelerate their differentiated product innovation.
The Integrity 3D-IC platform offers an efficient solution for deploying 3D design and analysis workflows for creating robust, silicon-stacked designs. The platform is part of the Cadence digital and endorsement product portfolio and aligns with the broader Cadence smart system design™ strategy, enabling excellence in system-on-chip (SoC) design.
About cadence
Cadence is a proven leader in electronic systems design, backed by more than 30 years of computing software expertise. The company applies its underlying Intelligent Systems Design strategy to deliver software, hardware and intellectual property that turn design concepts into reality. Cadence’s customers are the most innovative companies in the world, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic applications in the market, including large-scale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For seven consecutive years, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
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